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| SMT温度场的数学模型 | |
| 引用本文： | 黄丙元,孙桂珍,张同岭.SMT温度场的数学模型[J].电子工艺技术,2005,26(6):333-335. |
| 作者姓名： | 黄丙元 孙桂珍 张同岭 |
| 作者单位： | 1. 天津大学,天津,300072 2. 武警指挥学院,天津,300161 3. 商河电业公司,山东,济南,251600 |
| 摘 要： | SMT再流焊温度场是非常复杂的,因而在设定再流焊工艺时,通常采用反复试验的方法,不仅耗费巨大的人力、物力,并且很难建立一个好的工艺.利用传热学的知识结合再流焊通用的红外加热风再流焊焊接设备,建立再流焊温度场的数学模型,从而为再流焊的仿真打下基础. |
| 关 键 词： | 表面贴装技术 再流焊 温度场 模型 |
| 文章编号： | 1001-3474（2005）06-0333-03 |
| 收稿时间： | 2005-10-08 |
Mathematics Model of Reflow Soldering Temperature Field in SMT |
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| HUANG Bing-yuan,SUN Gui-zhen,ZHANG Tong-ling.Mathematics Model of Reflow Soldering Temperature Field in SMT[J].Electronics Process Technology,2005,26(6):333-335. | |
| Authors: | HUANG Bing-yuan SUN Gui-zhen ZHANG Tong-ling |
| Affiliation: | 1. Tianjin University, Tianjin 300072, China; 2. The Armed Police Directs College of Tianjin, Tianjin 300161, China; 3. The Electric Company of Shanghe, Jinan 251600, China |
| Abstract: | The temperature field of SMT is very complicated. When we design the process of SMT, we usually accord to our Experience. This method is not only costing great money and human, but also difficultly setting up a good process. Using the knowledge of transmit heat and the equipment of infrared with hot wind, we set up the mathematics modeling of temperature field of SMT. This is base for the establishing simulation of SMT. |
| Keywords: | SMT Reflow soldering Temperature field Model |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |
