Fracture toughness of Cu-Sn intermetallic thin films |
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Authors: | B Balakrisnan C C Chum M Li Z Chen T Cahyadi |
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Affiliation: | (1) Institute of Materials Research and Engineering, 117602 Singapore;(2) School of Materials Engineering, Nanyang Technological University, 639798 Singapore |
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Abstract: | Intermetallic compounds (IMCs) are formed as a result of interaction between solder and metallization to form joints in electronic
packaging. These joints provide mechanical and electrical contacts between components. The knowledge of fracture strength
of the IMCs will facilitate predicting the overall joint property, as it is more disposed to failure at the joint compared
to the solder because of its brittle characteristics. The salient feature of this paper is the measurement of the fracture
toughness and the critical energy-release rate of Cu3Sn and Cu6Sn5 intermetallic thin films, which is the result of the interaction between Sn from the solder and Cu from the metallization.
To achieve the objective, a controlled buckling test was used. A buckling test in the current work refers to one that displays
large transverse displacement caused by axial compressive loading on a slender beam. The stress and strain along the beam
can be easily calculated by the applied displacement. Fracture-toughness values of Cu3Sn and Cu6Sn5 are 2.85 MPa √m ± 0.17 MPa √m and 2.36 MPa √m ± 0.15 MPa √m, respectively. Corresponding critical energy-release rate values
are 65.5 J/m2 ± 8.0 J/m2 and 55.9 J/m2 ± 7.3 J/m2, respectively. The values obtained were much higher than the ones measured in bulk intermetallic samples but correlated well
with those values obtained from conventional fracture-toughness specimens when fracture was confined within the intermetallic
layers. Hence, the controlled buckling test is a promising fast and effective way to elucidate mechanical properties of thin
films. |
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Keywords: | Fracture toughness critical energy-release rate thin intermetallic films Cu3Sn Cu6Sn5 controlled buckling test |
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