Diffusion-Reaction in the Au-Rich Ternary Au-Pt-Sn System
as a Basis for Ternary Diffusion Soldering |
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Authors: | Vincent Grolier Rainer Schmid-Fetzer |
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Affiliation: | (1) Institute of Metallurgy, Clausthal University of Technology, Robert-Koch-Str. 42, D-38678 Clausthal-Zellerfeld, Germany |
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Abstract: | Basic thermodynamic considerations indicate nonequilibrium between gold-tin intermetallic phases and platinum. Therefore,
diffusion and reactions in the Au-Pt-Sn(-Ti) thin-film system have been investigated, and a mechanism of reaction is proposed
based on experimental results and thermodynamic considerations. The present paper may also help researchers understand previous
results that could be interpreted differently based on the new results of this work and basic thermodynamic considerations.
A ternary diffusion soldering concept has been proposed, and its application on up to 4-inch wafer-scale bonding was successful.
Generalizations of the present approach to other bonding systems appears promising. |
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Keywords: | Au-Pt-Sn diffusion-reaction thermodynamics diffusion soldering lead-free solder |
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