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A Robust Novel Technique for SPICE Simulation of ESD Snap-back Characteristics |
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| Authors: | JIAO Chao YU Zhiping |
| Affiliation: | Institute of Microelectronics, Tsinghua University, Beijing 100084, China |
| Abstract: | ElectoStatic discharge （ESD）, SPICE（Simulation program with integrated circuit emphasis）simulation, Snap-back, Gate-grounded NMOS （GGN-MOS）, Gate-coupled NMOS （GCNMOS）, Compact model. |
| Keywords: | ElectoStatic discharge （ESD） SPICE（Simulation program with integrated circuit emphasis）simulation Snap-back Gate-grounded NMOS （GGN-MOS） Gate-coupled NMOS （GCNMOS） Compact model |
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