激光划切硅工艺的探讨

划切主要分为砂轮和激光划切两种,而激光划切因其相干性好、方向性强、单色性好、划切效率高的特点,被广泛应用于半导体器件的划切工艺过程中。激光划切主要有红外划切及紫外划切两种工艺,又因为紫外光波长较短,频率较高的特点,使得划切时连续性更好,划切宽度更窄。通过大量的紫光划切工艺实验,建立了紫光划切工艺的最优频率、功率、划切速度等基本工艺,并把此工艺应用于实际生产过程中,取得了较为理想的效果。

Discussion on Laser Cutting Silicon

Scribing is mainly divided into grinding wheel and laser scribing.Laser scribing is widely used in the scribing process of semiconductor devices because of its good coherence,strong directivity,good monochromaticity and high scribing efficiency.Laser cutting mainly includes infrared cutting and ultraviolet cutting.Due to the characteristics of short wavelength and high frequency of ultraviolet light,the continuity of cutting is better and the cutting width is narrower.Through a large number of purple light cutting process experiments,the basic processes such as optimal frequency,power and cutting speed of purple light cutting process are established.This process is applied to the actual production process and achieved ideal results.