| 用显微红外热成像技术分析功率器件可靠性 |
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| 引用本文： | 梁法国,翟玉卫,吴爱华.用显微红外热成像技术分析功率器件可靠性[J].微纳电子技术,2011,48(5):338-342. |
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| 作者姓名： | 梁法国 翟玉卫 吴爱华 |
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| 作者单位： | 中国电子科技集团公司,第十三研究所,石家庄,050051 |
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| 摘 要： | 利用显微红外热成像技术对功率器件进行热可靠性分析。先从理论上阐述了显微红外热成像技术的原理,进而尝试利用该技术进行微波功率器件可靠性筛选工作,通过分析获取了显微红外图像中的温度分布和峰值温度,大大提高了器件可靠性筛选工作的准确性。在功率器件失效分析方面,利用显微红外热成像技术对发生失效的器件进行热成像和分析,通过定位失效点找到器件发生失效的原因。另外,还利用该技术来验证器件热设计的成功与否,通过显微红外热成像获取的温度信息如峰值温度、温度分布等来判断器件的热设计是否符合要求,在实际的器件设计过程中起到了良好的效果。
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| 关 键 词： | 功率器件 显微红外热成像 可靠性 热分析 热设计 |
Reliability Analysis of Power Devices by Infrared(IR) Thermography |
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| Liang Faguo,Zhai Yawei,Wu Aihua.Reliability Analysis of Power Devices by Infrared(IR) Thermography[J].Micronanoelectronic Technology,2011,48(5):338-342. |
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| Authors: | Liang Faguo Zhai Yawei Wu Aihua |
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| Affiliation: | Liang Faguo,Zhai Yuwei,Wu Aihua(The 13th Research Institute,CETC,Shijiazhuang 050051,China) |
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| Abstract: | The infrared(IR) thermography technology was applied in the reliability analysis for power devices.At first,the principle of the IR technology was introduced based on the theory,and then the reliability screening test for power devices was carried out by the technology.The temperature distribution and the peak temperature in the thermal image were obtained by the analysis,and the accuracy of the reliability screening test was enhanced greatly.In the failure analysis of power devices,the thermal images and a... |
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| Keywords: | power devices infrared(IR) thermography reliability thermal analysis thermal design |
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