低介电常数高耐热多层线路板用基板材料

Polyphenylene（聚酰亚胺）树脂带有非常好的介电性能，通过对Polyphenylene分子细量化，然后和带有好架桥性能以及可溶混性的树脂搅拌，开发出了同时带有低诱电（Low-Dk）和高耐热性，适用于高速信号传输设备使用的多层线路板材料。这个材料性能为Dk=3.8, Df=0.005(1 GHz), Tg=210℃。在5 GHz的使用条件下，与传统的材料相比，降低信号损失约15 db/m。可以广泛的应用在如网络设备等的高速，大容量信号传输设备。

Low-eielectric, high Hear-tesistant material for multilayer printed wiring board

In the multilayer printed wiring board material used for high-speed transmission equipment, high- frequency capable material with low dielectric properties and high heat-resistance has been developed by reducing the molecular weight of polyphenylene ether resin, which has excellent dielectric properties, and blending it with a cross-linking agent having high miscibility with the resin. This material presents the characteristics of dielectric constant 3.8, dielectric loss tangent 0.005（1 GHz）, glass transition temperature 210℃, and capable of reducing the transmission loss of a printed wiring board by approx 15db/m at 5 GHz compared with the conventional material, thereby enabling wide applications in high-end electronic equipment such as network equipment requiring high- speed and large-capacity transmission.