适用于高速PCB的三维热设计模块

随着高速PCB设计的数量不断增加,对确保布线、信号完整性和热设计要求造成了很大的困难。为了能够应付这一现象,美国CiscoSystems公司已经推出了一款可以进行温度预测设计流量的产品,它能够极大的改善电路设计师和机械设计师之间的共同设计协调性。设计师们可以通过PCB设计软件进行相关信息的交流,以有助于热分析工作的开展。

3D Thermal Modeling for High-Speed PCB

The increasing density of high-speed PCB designs is making it more difficult to simultaneously meet layout,signal integrity and thermal requirements. In response,Cisco Systems has defined a temperature aware design flow that significantly improves co-design between electrical and mechanical engineers. Designers begin by transfer-ring information from the PCB design software to thermal analysis.