底部填充工艺探讨

底部填充工艺是倒装芯片封装过程中的一个必不可少而且很关键的组成部分,底部填充工艺的成败将直接影响到封装的可靠性。本文针对底部填充工艺中需考虑的多个方面,如分配模式、胶水体积计算、硬件选择等,阐述如何改进工艺,增强底部填充的自动生产的能力。

Discussion of underfill process

Underfill process is a necessary and important part of Flip Chip assembly,and the success of underfill process will affect the long term reliability of Flip Chip package directly.In this paper,several aspects are taken into consideration,such as dispensing pattern,calculation of adhesive volume,selection of dispensing pump,and so on,interpreting how to improve the process to enhance the ability of automated underfill production.