Applications of single-wafer thermal processing to 0.15-/spl mu/m high-density MROM |
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Authors: | Shu-Ya Hsu Tzu-Yu Wang Hsueh-Hao Shih Kuang-Chao Chen Yaw-Lin Hwang Cheng-Chen Hsueh Chung H Pan S Chih-Yuan Lu |
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Affiliation: | Si Lab., Macronix Int. Co. Ltd., Hsinchu, Taiwan; |
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Abstract: | Feasibility of single-wafer rapid-thermal process as an alternative to the conventional batch-type furnace process is evaluated on a 0.15-/spl mu/m 128-Mb mask read only memory (MROM) product. Excellent gate oxide integrity and device characteristics are achieved with a single-wafer rapid-thermal process. Superior yield and product reliability by using single-wafer process tool have also been achieved. Shortened process cycle time and better thermal process uniformity by using single-wafer rapid-thermal processing are demonstrated. |
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