基于MS-ECO的多模式多端角签收时序修复方法的研究

为了使现代超大规模数字芯片物理设计在签收阶段更快、更好地达到时序收敛，基于MS-ECO时序修复引擎，结合后端签收工具Tempus的精确度和后端实现工具Innovus的高效性，采用分布式多模式多端角时序分析，提出了一种跨平台签收阶段自动时序修复方法。在3个不同工艺的数字芯片上验证了该方法。结果表明，该方法平均能使时序违例路径减少86%，并使WNS降低72%，TNS降低89%。同时，该时序修复方法没有引入新的设计规则违例(DRV)。

A MS-ECO based methodology for multi-corner multi-mode signoff timing optimization

In order to obtain a better and quicker timing closure at signoff stage of VLSI physical design, a MS-ECO based cross-platform auto-optimization methodology have been proposed. The methodology takes advantages of the accuracy of Tempus and the efficiency of Innovus, adopting distributed timing analysis. The methodology has been applied on 3 different circuits based on different fabrication process. The experiment result shows that, on average, this method can help designer to reduce the total number of violating path by 86%, and reduce WNS, TNS by 72% and 89% respectively. Meanwhile, no DRV is introduced by this method.