| 基于对数正态分布参数判别加速实验中失效机理一致性 |
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| 引用本文： | 郭春生,张燕峰,万宁,朱慧,冯士维.基于对数正态分布参数判别加速实验中失效机理一致性[J].半导体学报,2014,35(8):084010-5. |
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| 作者姓名： | 郭春生 张燕峰 万宁 朱慧 冯士维 |
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| 基金项目： | 国家自然科学基金，广东省产学研项目，广东省重大科技专项项目 |
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| 摘 要： | The failure mechanism stimulated by accelerated stress in the degradation may be different from that under normal conditions, which would lead to invalid accelerated life tests. To solve the problem, we study the re- lation between the Arrhenius equation and the lognormal distribution in the degradation process. Two relationships of the lognormal distribution parameters must be satisfied in the conclusion of the unaltered failure mechanism, the first is that the logarithmic standard deviations must be equivalent at different temperature levels, and the second is that the ratio of the differences between logarithmic means must be equal to the ratio of the differences between reciprocals of temperature. The logarithm of distribution lines must simultaneously have the same slope and regular interval lines. We studied the degradation of thick-film resistors in MCM by accelerated stress at four temperature levels （390, 400, 410 and 420 K）, and the result agreed well with our method.
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| 关 键 词： | 对数正态分布 加速寿命试验 失效机理 Arrhenius方程 加速应力 对数平均值 厚膜电阻器 降解过程 |
Identifying the failure mechanism in accelerated life tests by two-parameter lognormal distributions |
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| Guo Chunsheng,Zhang Yanfeng,Wan Ning,Zhu Hui and Feng Shiwei.Identifying the failure mechanism in accelerated life tests by two-parameter lognormal distributions[J].Chinese Journal of Semiconductors,2014,35(8):084010-5. |
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| Authors: | Guo Chunsheng Zhang Yanfeng Wan Ning Zhu Hui and Feng Shiwei |
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| Affiliation: | College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China;College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China;College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China;College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China;College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China |
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| Abstract: | The failure mechanism stimulated by accelerated stress in the degradation may be different from that under normal conditions, which would lead to invalid accelerated life tests. To solve the problem, we study the relation between the Arrhenius equation and the lognormal distribution in the degradation process. Two relationships of the lognormal distribution parameters must be satisfied in the conclusion of the unaltered failure mechanism, the first is that the logarithmic standard deviations must be equivalent at different temperature levels, and the second is that the ratio of the differences between logarithmic means must be equal to the ratio of the differences between reciprocals of temperature. The logarithm of distribution lines must simultaneously have the same slope and regular interval lines. We studied the degradation of thick-film resistors in MCM by accelerated stress at four temperature levels (390, 400, 410 and 420 K), and the result agreed well with our method. |
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| Keywords: | Arrhenius model accelerated life tests failure mechanisms lognormal distribution |
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