| 电镀技术在凸点制备工艺中的应用 |
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| 引用本文： | 罗驰,练东.电镀技术在凸点制备工艺中的应用[J].微电子学,2006,36(4):467-472. |
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| 作者姓名： | 罗驰 练东 |
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| 作者单位： | 中国电子科技集团公司,第二十四研究所,重庆,400060 |
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| 摘 要： | 简要回顾了微电子封装的发展历程;描述了FC、BGA、CSP以及WLP的基本概念;归纳了凸点类型以及各种凸点的不同用途;着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程,最后简单介绍了制备凸点的电镀设备。
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| 关 键 词： | 微电子封装 芯片级封装 圆片级封装 电镀 凸点制备 |
| 文章编号： | 1004-3365（2006）04-0467-06 |
| 收稿时间： | 2006-01-12 |
| 修稿时间： | 2006-01-122006-05-24 |
Application of Electroplating Technology to Solder Bumping Formation |
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| LUO Chi,LIAN Dong.Application of Electroplating Technology to Solder Bumping Formation[J].Microelectronics,2006,36(4):467-472. |
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| Authors: | LUO Chi LIAN Dong |
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| Affiliation: | Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corp. , Chongqing 400060, P. R. China |
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| Abstract: | The evolution of microelectronics packaging is briefly reviewed.Basic concepts of flip chip(FC),ball grid array(BGA),chip size package(CSP)and wafer level package(WLP)are dealt with.Different types of bumpings and their applications are summerized.Electroplating processes of Au,Au-Sn,Sn-Pb,Sn-Ag and chemical nickel-plated bumpings are described in particular.And finally,electroplating equipments for bumping formation are introduced. |
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| Keywords: | Microelectronics packaging Chip size package Wafer level package Electroplating Solder bumping |
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