| 测定电镀液中铜、锡的新方法 |
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| 引用本文： | 秦淑琪,何英.测定电镀液中铜、锡的新方法[J].西北师范大学学报,2005,41(3):52-54. |
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| 作者姓名： | 秦淑琪 何英 |
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| 作者单位： | 西北师范大学化学化工学院 甘肃兰州730070
(秦淑琪)，兰州师范高等专科学校化学系 甘肃兰州730070(何英) |
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| 基金项目： | 甘肃省教委科研基金资助项目(95-22) |
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| 摘 要： | 建立了交流示波极谱法连续测定镀铜锡合金电解液中铜、锡的新方法.采用汞膜电极、钨电极的配位滴定法,以EDTA、铅为标准溶液,连续测定镀铜锡电解液中的铜、锡及焦磷酸盐、正磷酸盐的含量.方法简便,快速,终点直观,结果准确.
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| 关 键 词： | 交流示波极谱法 电镀液 铜 锡 |
| 文章编号： | 1001-988X(2005)03-0052-03 |
| 修稿时间： | 2004年1月7日 |
The new method of continuously determinating copper and stannum in electroplating solution |
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| QIN Shu-qi,HE Ying.The new method of continuously determinating copper and stannum in electroplating solution[J].Journal of Northwest Normal University Natural Science (Bimonthly),2005,41(3):52-54. |
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| Authors: | QIN Shu-qi HE Ying |
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| Affiliation: | QIN Shu-qi~1,HE Ying~2 |
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| Abstract: | A new method of continuously determinating copper and stannum in electroplating solution is stated by oscillopolarography.Coordination titration is used with mercury membrane electrode and wolfram as working and reference electrodes.Standard solution consists of EDTA,plumbum.The method is simple,rapid and accurate with audio-visual end point. |
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| Keywords: | oscillopolarography electroplating solution copper stannum |
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