在辉光放电电解等离子体处理的铜基表面上接枝硬脂酸制备超疏水材料

利用辉光放电电解等离子体技术对铜基底表面进行活化,再经硬脂酸修饰,得到铜基底超疏水性材料.考查了Na2SO4浓度、放电电压、放电时间、硬脂酸-甲醇溶液浓度、接枝时间以及接枝温度对超疏水表面性能的影响.用接触角仪、X射线衍射(XRD)、X射线光电子能谱(XPS)、红外光谱(FTIR)对铜表面的润湿性、表面元素组成及结构进行了表征和分析.结果表明,经修饰的铜基底表面具有良好的疏水性,接触角高达155.30°,滚动角小于5°,且稳定性良好.

Fabrication of superhydrophobic copper-surface by using glow-discharge electrolysis plasma

An advanced oxidation technology,glow-discharge electrolysis plasma,has been successfully used in the fabrication of superhydrophobic copper-surfaces,that is,stearic acid is grafted onto the copper-substrate.To optimize the fabrication conditions,seven important parameters are examined in detail,such as the concentration of supporting electrolyte,stearic acid ethanol solution,discharge voltage,discharge time,species of alcohol,grafting time and temperature.The wettability,structure and ultimate composition of copper substrate are characterized by contact goniometer,X-ray diffraction(XRD),X-ray photoelectron spectroscopy(XPS),Fourier transform infrared spectroscopy(FT-IR),respectively.It is found that under the optimal conditions,the contact angle(CA) for the modified copper-substrate surfaces is up to 155.30° and the sliding angle(SA) less than 5°.