不同制备工艺对WC/Cu功能梯度材料性能的影响

遵循常规粉末冶金法,采用埋粉烧结和真空热压烧结两种工艺制备出三层WC/Cu功能梯度材料。研究结果表明:真空热压烧结工艺明显改善了Cu基体与WC颗粒之间的结合状况且材料的密度也得到了提高。还研究了WC体积分数对单层WC/Cu复合材料性能的影响,采用以上两种烧结工艺分别制备出两种不同WC体积分数的单WC/Cu复合材料试样,研究结果表明:在相同WC体积分数下,真空热压烧结明显提高了烧结体的电导率和硬度;另外,在同种烧结工艺情况下,烧结体的硬度随着WC体积分数的增加而增加,而材料的电导率随WC体积分数的增加而减小。

The Effect of Different Processes on WC/Cu Functionally Graded Materials' Properties

Follow the conventional powder metallurgy, using buried powder sintering technology and vacuum hot-pressed sintering technology, the three- layer WC / Cu functionally graded material was made. The results show that: vacuum hot-pressed sintering technology significantly improves the bonding situation of Cu substrate and WC particles and the density has also been improved. We also studied the effect of the volume fraction of WC on single WC / Cu composite material properties by using these two kinds of sintering Technology to prepare severally two single WC / Cu composite sample of different volume fraction of WC. The results show that: in the same volume fraction of WC, vacuum hot-pressed sintering significantly improves the conductivity and hardness of sintered body. In addition, under the same sintering process, the hardness of sintered body will increase and the conductivity of materials will decrease with the increase of volume fraction of WC.