| 印刷电路板用热固阻焊油墨LTR-1的研制 |
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| 引用本文： | 余满春,刘欣,张立红.印刷电路板用热固阻焊油墨LTR-1的研制[J].辽宁化工,2004,33(2):76-79. |
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| 作者姓名： | 余满春 刘欣 张立红 |
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| 作者单位： | 大化集团有限责任公司,辽宁,大连,116032 |
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| 摘 要： | 介绍了印刷电路板用热固阻焊油墨LTR - 1研制的试验情况、技术指标 ,对连结树脂 (热固性树脂 )的制备工艺条件进行优化 ,根据试验确定了连结树脂、稀释剂、固化剂、着色剂、填充料、增稠剂、消泡剂、流平剂的最佳配比
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| 关 键 词： | 电路板 线路板 阻焊油墨 热固阻焊油墨 |
| 文章编号： | 1004-0935(2004)02-076-04 |
| 修稿时间： | 2003年11月26 |
Development of a LTR-1 Type Thermosetting Solder Resist Ink for Printed Circuit Board |
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| YU Man chun,LIU Xin,ZHANG Li hong.Development of a LTR-1 Type Thermosetting Solder Resist Ink for Printed Circuit Board[J].Liaoning Chemical Industry,2004,33(2):76-79. |
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| Authors: | YU Man chun LIU Xin ZHANG Li hong |
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| Abstract: | The experiment and technical index of a LTR-1 type thermosetting solder resist ink for Printed Circuit Board were introduced, including the optimizing of the process conditions for link-resin manufacture. Based on the experimentation, the optimal proportion of link-resin, thinner, curing agent, colorant, filling agent, thickening agent, antifoaming agent and flow aid agent was determined. |
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| Keywords: | PCB Printed Circuit Board solder resist ink thermosetting solder resist ink |
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