图形电镀不满缸生产的优化

随着PCB市场发展,为提高企业竞争力,部分线路板厂选择"小批量、多品种"的战略路线。但该类产品为企业带来经济效益的同时,也对过程控制提出新的要求,特别是在图形电镀流程。在不满缸生产情况下,飞巴两侧会使用废弃的板料做为电镀边条以减少边缘效应。但此种常规边条电镀面积无法精确计算,会造成电流的不均匀分布。本文对垂直电镀不满缸生产可能带来的影响因素进行分析,通过试验验证并设计新型电镀边条加以改善,达到优化不满缸生产的目的。

Optimization of Non-full plating window for pattern plating

With the market development, some PCB manufactories select the strategy of ＂low-volume, multi-species＂ to enhance the competitiveness. Lots of PCB shops benefit from this strategy and promote their profits. However, this strategy also puts forward new requirements for process control, especially when the pattern plating windows are not full. In this case, we must use some pieces of laminate board which is discarded on both sides of flight bar in order to reduce edge effects of plating. But, the plating areas of this kind of plating strake can not be accurately calculated, leading to non-uniformity of current distribution. In this paper, we discuss the impact of the non-full window pattern plating and cast light on a new type of plating strake which can be reused to improve uniformity of current distribution, achieving a optimization for the non-full window pattern plating.