化学镀铜表面烷基膦酸自组装单分子膜的制备及表征

通过脉冲恒电位强化技术，在新生的化学镀铜样品表面上制备了烷基膦酸自组装单分子膜，测试了自组装单分子膜的电化学和谱学特性，以及润湿性变化规律。结果表明在1%烷基膦酸溶液，脉冲恒电位强化制备的自组装膜腐蚀电流较空白样品下降了98.4%，反应阻抗值相应增加，其自组装膜抑制了铜电极腐蚀反应的阳极过程，使得控制步骤由氧的扩散转变为界面电荷转移；FT-IR检测证实了样品表面成功组装了烷基膦酸单分子膜，脉冲恒电位强化处理的对应吸收峰相对较大；接触角测试间接印证了烷基膦酸已组装成膜，样品表面的润湿性由亲水性转为疏水性，脉冲恒电位强化处理后自组装单分子膜的接触角θ增加了39°，说明脉冲恒电位强化使组装膜更为致密。 

Rreparation and characterization of Alkyl phosphoric self-assembled monolayers on electroless copper film surface

Self-assembled monolayers of alkyl phosphonic acids were prepared on the surfaces of freshly made-up electroless copper plated samples by pulsed constant-voltage/potentiostatic pulse enhancement in order to analyse the electrochemical, spectral properties and wettability of self-assembled monolayers. Results showed that the corrosion currents of those self-assembled monolayers decreased 98.4% in 1% alkyl phosphonic acid solution, and their electrochemical impedance increased correspondingly, compared with those of blank samples. In that case, self-assembled monolayers inhibited the anodic process of the corrosion reaction, which lead to interfacial charge transfer instead of oxygen diffusion. FT-IR spectroscopy confirmed that the alkyl phosphonic acid monomolecular film was successfully assembled on the surfaces of electroless copper plated samples, and their corresponding absorption peak of became relatively larger after enhanced by the pulsed constant-voltage. Contact angle test indirectly also affirmed that the alkyl phosphonic acid solution was assembled into films, samples' hydrophilic surface converted into hydrophobic, and the contact angle θ of the self-assembled monomolecular films increased by 39° after the pulsed potentiostatic enhancement treatment, indicating that the pulsed potentiostatic enhancement made the assembled film denser.