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| 导电相和固化剂对铜系导电涂料性能的影响 | |
| 引用本文： | 杜仕国,闫军,张同来,崔海萍.导电相和固化剂对铜系导电涂料性能的影响[J].电子元件与材料,2004,23(12):40-42,46. |
| 作者姓名： | 杜仕国 闫军 张同来 崔海萍 |
| 作者单位： | 1. 北京理工大学爆炸灾害预防与控制国家重点实验室,北京,100081;军械工程学院,河北,石家庄,050003 2. 军械工程学院,河北,石家庄,050003 3. 北京理工大学爆炸灾害预防与控制国家重点实验室,北京,100081 |
| 摘 要： | 利用IR、SEM等手段,较详细地研究了铜粉–环氧树脂体系中固化剂与铜粉的相互作用,并探讨了铜粉用量、形状对涂料导电性能的影响规律。结果表明:固化剂(最佳用量为20%左右)可以通过形成配合物的反应,有效除去铜粉表面的氧化物,极大改善涂料导电性,使填充75%铜粉的体系具有约0.2×104Ω·m的体积电阻率。应用渗流模型和导电通道理论分析铜粉的用量、形状对涂料导电性能的影响规律。 |
| 关 键 词： | 有机高分子材料 导电涂料 导电性能 环氧树脂 铜粉 固化剂 |
| 文章编号： | 1001-2028(2004)12-0040-03 |
Research on the Effect of the Ingredients on the Conductivity of the Copper Powder-epoxy Resin Conductive Paints |
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| DU Shi-guo,YAN Jun,ZHANG Tong-lai,CUI Hai-ping.Research on the Effect of the Ingredients on the Conductivity of the Copper Powder-epoxy Resin Conductive Paints[J].Electronic Components & Materials,2004,23(12):40-42,46. | |
| Authors: | DU Shi-guo YAN Jun ZHANG Tong-lai CUI Hai-ping |
| Affiliation: | DU Shi-guo1,2,YAN Jun2,ZHANG Tong-lai1,CUI Hai-ping2 |
| Abstract: | In the preparation of conductive paints of epoxy resin filled with copper powders the reaction between the curing agent and copper was studied in detail by means of SEM and IR. The analysis indicates that the curing agent can remove the oxide on the surface of the copper powder ensuring the paints filled with 75% of copper powder high conductivity of 0.2×10-4Ω·m. The relationship between the shape and content of the copper powders and the conductivity of the paints are discussed, and the results are explained by related theory. |
| Keywords: | organic polymer materials conductive paint conductivity epoxy resin copper powder curing agent |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |
