| AgCu28真空焊料原料银脱气工艺的研究 |
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| 引用本文： | 胡星福,柏小平.AgCu28真空焊料原料银脱气工艺的研究[J].电工材料,2003(4):24-28. |
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| 作者姓名： | 胡星福 柏小平 |
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| 作者单位： | 浙江福达合金材料股份有限公司,温州,325604 |
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| 摘 要： | 对AgCu28真空焊料原料银脱气工艺进行了研究。银锭采用石墨坩埚真空熔炼脱气法，银粉采用真空脱气法，两种方法生产的AgCu28真空焊料的溅散性可达A级，清洁性可达I—Ⅱ级。此两种方法工艺简单，生产效率高，生产成本低。
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| 关 键 词： | AgCu28 真空焊料 银粉 脱气工艺 焊料 |
| 修稿时间： | 2003年7月8日 |
Study of the Degassing Process of Raw Material Silver for AgCu28 Vacuum Solder |
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| HU Xing-fu.BAI Xiao-ping.Study of the Degassing Process of Raw Material Silver for AgCu28 Vacuum Solder[J].Electrical Engineering Materials,2003(4):24-28. |
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| Authors: | HU Xing-fuBAI Xiao-ping |
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| Abstract: | Describing the study of the degassing process of raw material silver for AgCu28 Vacuum Solder. Vacuum malting degassing method with graphite crucible is used for silver ingot.vacuum degassing method is used for silver powder. The splash scatterness of The AgCu28 vacuum solders produced with these two methods can reach A level,Cleanness can reach to 1 - I class . These two methods have the characteristics of simple process.high production efficiency and low production cost. |
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| Keywords: | AgCu28 vacuum solder silver ingot silver powder splashing scatterness |
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