| 印制电路板通孔的电镀技术 |
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| 引用本文： | 陈智栋,梁学敏,光崎尚利.印制电路板通孔的电镀技术[J].印制电路信息,2003(7):42-45. |
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| 作者姓名： | 陈智栋 梁学敏 光崎尚利 |
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| 作者单位： | 1. 江苏工业学院,213016
2. 太洋テクノサビスSFT研究所,554-0052 |
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| 摘 要： | 印制板通孔的金属化是一个极其复杂的过程,它涉及到去残渣、活化、化学镀铜和电镀铜,为了得到品质优良的产品,必须严格控制每一项操作。本文通过对生产现场易出现的问题,提出了对上述各工序管理的注意点。
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| 关 键 词： | 印制板 通孔 电镀 |
Technology of Through Hole Plating of Printed Circuit Board |
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| Chen Zhidong Liang Xuemin Mitsuzaki-Naotoshi.Technology of Through Hole Plating of Printed Circuit Board[J].Printed Circuit Information,2003(7):42-45. |
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| Authors: | Chen Zhidong Liang Xuemin Mitsuzaki-Naotoshi |
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| Affiliation: | Chen Zhidong Liang Xuemin Mitsuzaki-Naotoshi |
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| Abstract: | Through hole plating of printed circuit board is a very complicated process. Hole metallization involves the procedures of dismear, activation, electroless plating and electroplate copper. We must strictly control every part of the operation so as to produce top-grade products. In the paper we will bring up several cautions in the working procedures mentioned above, which quite often come out at the producing spot. |
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| Keywords: | printed circuit board through hole electroplate |
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