SIS技术参数对其热熔压敏胶性能的影响

研究了SIS的技术参数对SIS热熔压敏胶性能的影响。试验表明,星型结构的SIS热熔压敏胶熔融黏度较低,持粘性、剥离强度较大,软化点较高;嵌段比增大,SIS热熔压敏胶的初粘性降低、持粘性增大、熔融黏度减小、软化点升高;分子质量增大,SIS热熔压敏胶的初粘性降低、持粘性增大、熔融黏度增大、软化点升高;2嵌段SI含量增加,SIS热熔压敏胶初粘性增大、持粘性降低,180°剥离强度先增大后减小,且压敏胶的熔融黏度减小、软化点降低、分切性能变好。

Effects of SIS technical parameters on performances of its hot melt pressure sensitive adhesive

In this article,the effects of technical parameters of SIS on the performances of its hot melt pressure sensitive adhesives were studied.The results showned that the hot melt pressure sensitive adhesive of star-shaped SIS had low melting viscosity,great hold power and peeling strength and high softening point;with the increase of block ratio,SIS hot melt pressure sensitive adhesive had lower tack,greater hold power,lower melt viscosity and higher softening point;with the increase of molecular weight,the tack of SIS hot melt pressure sensitive adhesive decreased, its hold power and melting viscosity increased and softening point rose;with the increase of the content of SI block,the tack of SIS hot melt pressure sensitive adhesive increased,the hold power decreased,the 180° peeling strength increased first and then decreased,the melting viscosity and softening point decreased and the die-cutting property became better.