| 塑封球栅阵列焊点在温度循环下可靠性数值模拟 |
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| 引用本文： | 刘洋,孙凤莲,王丽凤.塑封球栅阵列焊点在温度循环下可靠性数值模拟[J].哈尔滨理工大学学报,2007,12(5):84-86,90. |
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| 作者姓名： | 刘洋 孙凤莲 王丽凤 |
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| 作者单位： | 哈尔滨理工大学,材料科学与工程学院,黑龙江,哈尔滨,150040 |
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| 基金项目： | 国家自然基金项目(50575060)，哈尔滨市科技创新人才专项基金项目(2006RFQXG047)． |
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| 摘 要： | 根据实际封装器件建立了三维有限元分析模型,模拟了PBGA焊点在温度循环载荷下的蠕变应变,比较了95.5Sn-3.8Ag-0.7Cu和63Sn-37Pb两种焊料形成的焊点在温度循环下的蠕变情况,预测了焊点在温度循环下的疲劳寿命,评价了两种焊点在温度循环条件下的可靠性.结果表明,两种焊点相比较,63Sn-37Pb焊点在循环中的蠕变现象更为显著,95.5Sn-3.8Ag- 0.7Cu焊点的疲劳寿命更长,可靠性更高.
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| 关 键 词： | PBGA 焊点 蠕变 可靠性 数值模拟 |
| 文章编号： | 1007-2683（2007）05-0084-03 |
| 修稿时间： | 2006-11-07 |
Numerical Simulation of Reliability of PBGA Solders under Thermal Cycling |
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| LIU Yang,SUN Feng-lian,WANG Li-feng.Numerical Simulation of Reliability of PBGA Solders under Thermal Cycling[J].Journal of Harbin University of Science and Technology,2007,12(5):84-86,90. |
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| Authors: | LIU Yang SUN Feng-lian WANG Li-feng |
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| Abstract: | 3-D Finite Element mold is generated acconting to actual package product.The creep strain of PB- GA(plastic ball grid array)solder joints under temperature loading is simulated.95.5Sn-3.8Ag-0.7Cu and 63Sn-37Pb are taken as two kinds of solder to be compared in this study.The creep strain,low cycle life and reli- ability of both solders are analyzed.The results show that 63Sn-37Pb solders joint creep more seriously in the cyc- ling process.And 95.5Sn-3.8Ag-0.7Cu solders have longer fatigue life,and a higher reliability under thermal cycling. |
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| Keywords: | PBGA solder creep reliability numerical simulation |
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