微电热驱动器中偏置层的分析

设计了一种电热微驱动器,根据几何关系、泰勒公式和材料力学求得偏置层结构末端的位移公式,并验证了采用镍作为偏置层材料的合理性.通过Coventorware软件中的有限元模块进行仿真分析,得出施加驱动电压为5 V,响应时间为5 ms,驱动器的初始温度为300 K时,得出偏置层宽度W1与驱动器位移d的曲线关系.通过验证驱动器的最大应力为235 MPa,小于镍的许用应力,确定驱动器在W1=20μm可以进行可靠的工作.分析偏置层厚度和宽度的加工误差对驱动器末端位移的影响,可得在对偏置层进行加工时要严格控制偏置层厚度H1的加工误差.

Analysis of the bias layer in the micro electro-thermal actuator

This paper designs a micro electro-thermal actuator. The displacement formula of the micro electro-ther-mal actuator derives from the geometric relations,the Taylor formula and materials mechanics. It is verified that the nickel used as the bias layer material is mainly the structural material. Finite element simulation using the Coventor-ware software on the bias layer,concludes that when voltage is 5 V,the response time is 5 ms,temperature is 300 K, the actuator displacement curve to the bias layer width(W1)can be acquired. The maximum stress of actuator is 235 MPa,is less than the allowable stress of nickel. Then,it has high reliability when W1=20μm can be obtained. It is analyzed that the machining error has great influence for the drive end displacement of thickness and width in the bias layer,and it concludes that the machining error of the bias layer thickness(H1)must be strictly controlled dur-ing machining.