| 离心铸造SiC颗粒增强铝基复合材料电子封装零件的成形研究 |
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| 引用本文： | 白莉,刘昌明,唐晓亮.离心铸造SiC颗粒增强铝基复合材料电子封装零件的成形研究[J].铝加工,2010(1):41-44. |
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| 作者姓名： | 白莉 刘昌明 唐晓亮 |
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| 作者单位： | 重庆大学材料科学与工程学院,重庆沙坪坝,400044 |
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| 摘 要： | 研究了离心铸造法制备SiC／Al复合材料电子封装零件的成形过程。在离心力场中，得到组织致密的铸件，实现零件的近终成型。显微组织结构观察表明，SiC颗粒均匀分布在基体合金中，细小的SiC颗粒充分填充到粗大颗粒的间隙中，分布均匀，无颗粒团聚现象，组织均匀致密，无夹渣、气泡等缺陷。
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| 关 键 词： | 离心铸造 SiCp／Al复合材料 电子封装零件 成形过程 |
Study on Fabrication of SiC Particles Reinforced Aluminum Matrix Composites for Electronic Packaging by Centrifugal Casting |
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| BAI Li,LIU Chang-ming,TANG Xiao-liang.Study on Fabrication of SiC Particles Reinforced Aluminum Matrix Composites for Electronic Packaging by Centrifugal Casting[J].Aluminium Fabrication,2010(1):41-44. |
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| Authors: | BAI Li LIU Chang-ming TANG Xiao-liang |
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| Affiliation: | College of Matrerials Sicence and Engineering/a>;Chongqing University/a>;Chongqing 400044/a>;China |
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| Abstract: | The fabrication process of SiC/Al composites for electronic packaging by centrifugal casting was investigated.The results of microstructure observation showed that the distribution of SiC particles in matrix alloy was uniform and the composites were commercially sound,free of defects such as inclusions and blisters. |
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| Keywords: | centrifugal casting SiCp/Al composite material electronic packaging parts fabrication process |
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