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毫米波无线通信半导体器件技术发展趋势
引用本文:王涛,赖凡.毫米波无线通信半导体器件技术发展趋势[J].微电子学,2022,52(2):169-180.
作者姓名:王涛  赖凡
作者单位:中电科技集团重庆声光电有限公司, 重庆 400060;中国电子科技集团公司 第二十四研究所, 重庆 400060
摘    要:随着通信产业尤其是移动通信的高速发展,无线电频谱的低端频率已趋饱和。采用各种调制方法或多址技术扩大通信系统的容量,提高频谱的利用率,也无法满足未来通信发展的需求,因而实现高速、宽带的无线通信势必向微波高频段开发新的频谱资源。毫米波由于其波长短、频带宽,可以有效地解决高速宽带无线接入面临的许多问题,因而在短距离无线通信中有着广泛的应用前景。各种半导体器件是信息和通信技术(ICT)的硬件基础,创造性研发满足毫米波无线通信应用的新兴半导体技术和电路,是提升通信系统容量、解决构建新一代通信系统关键问题的主要技术推手。文章沿着毫米波半导体器件技术创新发展脉络,从相控阵等关键技术的系统架构、半导体材料和工艺、器件设计和封装测试入手,分析总结了第五代(5G)、第六代(6G)移动通信技术毫米波系统和器件技术发展趋势。以美国DARPA的MIDAS计划为例,阐释了军用毫米波器件技术的研究前沿和进展。

关 键 词:毫米波    无线通信    相控阵    半导体    集成电路
收稿时间:2021/9/22 0:00:00

Semiconductor Devices Technology Development Trends of Millimeter Wave Wireless Communication
WANG Tao,LAI Fan.Semiconductor Devices Technology Development Trends of Millimeter Wave Wireless Communication[J].Microelectronics,2022,52(2):169-180.
Authors:WANG Tao  LAI Fan
Affiliation:Chongqing Acoustics-Optics-Electronics Co., Ltd., of China Electronics Technology Group Corporation, Chongqing 400060, P.R.China; The 24th Research Institute of China Electronics Technology Group Corporation, Chongqing 400060, P.R.China
Abstract:With the rapid development of communication industry, especially mobile communication, the low-end frequency of radio spectrum has become saturated. Using various modulation methods or multiple access technologies to expand the capacity of communication system and improve the utilization of spectrum can not meet the needs of future communication development. Therefore, the realization of high-speed and broadband wireless communication is bound to develop new spectrum resources to microwave high-frequency band. Millimeter wave can effectively solve many problems faced by high-speed broadband wireless access because of its short wavelength and wide frequency band, so it has a wide application prospect in short-range wireless communication. Various semiconductor devices are the hardware basis of information and communication technology (ICT). Creative research and development of emerging semiconductor technologies and circuits to meet the application of millimeter wave wireless communication is the main technical driver to improve the capacity of communication system and solve the key problems of building a new generation of communication system. Along the innovation and development of millimeter wave semiconductor device technology, this paper analyzed and summarized the development trend of millimeter wave system and device technology of the fifth and sixth generation mobile communication technologies (5G and 6G) from the system architecture, semiconductor materials and technology, device design and packaging test of key technologies such as phased array. Taking the MADAS program of DARPA as an example, this paper explained the research frontier and progress of military millimeter wave device technology.
Keywords:millimeter wave band  wireless communication  phased array  semiconductor  integrated circuit
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