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| 粘结材料对CTBGA封装组件热循环可靠性的影响 | |
| 引用本文： | 史洪宾,蔡琳,吴金昌.粘结材料对CTBGA封装组件热循环可靠性的影响[J].电子元件与材料,2011,30(7):67-71. |
| 作者姓名： | 史洪宾 蔡琳 吴金昌 |
| 作者单位： | 1. 广达上海制造城表面组装技术实验室，上海201613;复旦大学 信息科学与工程学院，上海200433 2. 新余学院 现代教育技术中心,江西新余,338004 3. 广达上海制造城表面组装技术实验室,上海,201613 |
| 摘 要： | 对使用了8种粘结材料的12 mm SAC305薄型球形栅格阵列(CTBGA)封装组件进行了热循环测试。结果显示，所有的粘结材料都降低了组件的热循环可靠性。具有较低线(热)膨胀系数，较高玻璃转化温度和储能模量的粘结材料可使组件热疲劳寿命相对更长，如使用了材料E(a11=48×10-6/℃；a12=184×10-6/℃；θ... |
| 关 键 词： | 粘结材料 薄型球形栅格阵列封装 热循环可靠性 |
Effects of adhesives on thermal cycle reliability of CTBGA assemblies |
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| SHI Hongbin,CAI Lin,WU Jinchang.Effects of adhesives on thermal cycle reliability of CTBGA assemblies[J].Electronic Components & Materials,2011,30(7):67-71. | |
| Authors: | SHI Hongbin CAI Lin WU Jinchang |
| Affiliation: | SHI Hongbin1,3,CAI Lin2,WU Jinchang1(1.Quanta Shanghai Manufacturing City Surface Mount Technology Laboratory,Shanghai 201613,China,2.Modern Education Technology Center,Xinyu University,Xinyu 338004,Jiangxi Province,3.School of Information Science and Engineering,Fudan University,Shanghai 200433,China) |
| Abstract: | The assemblies of 12 mm chiparray thin core ball grid array(CTBGA) components with Sn3.0Ag0.5Cu(SAC305) solder balls were mounted to the PCB and tested in thermal cycling with 8 adhesives.Results show that all of present adhesives reduce the thermal cycle reliability of assemblies.The adhesives with lower cofficient of thermal expansion(CTE) and higher glass transition temperature(θg) and storage modulus(Es) lead to longer thermal fatigue lifes of assemblies.For example,the characteristic life of assemblies with edge bond adhesive E(αll = 48×10-6/℃;αl2 = 184 ×10-6/℃;θg=138 ℃;Es = 3.660 GPa) is increased by 25.88% compared with that of assemblies with edge bonding adhesive D(αll = 157×10-6/℃;αl2=198 ×10-6/℃;θg=78 ℃;Es= 0.674 GPa),and the time to first failure is delayed by 57.71%. |
| Keywords: | adhesives CTBGA thermal cycle reliability |
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