Novel Loading‐Free Joining Process for YBCO Single‐Grain Bulks |
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| Authors: | Chia‐Ming Yang Yi‐Chang Huang In‐Gann Chen Maw‐Kuen Wu |
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| Affiliation: | 1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan;2. Institute of Physics, Academia Sinica, Taipei, Taiwan |
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| Abstract: | We report a novel joint fabrication method for YBa2Cu3O7?x (Y123) bulk superconductors without pressure loading, based on a well‐controlled high‐temperature process. Due to the direction of the heat fluxes in a box furnace, the surfaces of the joined samples melt first, and the crystal morphology of the original YBa2Cu3O7?x bulks remains. After the joining process, part of the texture zone is used as a seed to grow new texture crystals for nucleation during cooling. Finally, a high‐quality artificial grain boundary forms without acting as a weak link, which is supported by the trapped field distribution. Details of the joint are presented, including its microstructure and micro‐orientation. Moreover, the trapped field values at 65 and 45 K are presented. |
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| Keywords: | YBCO large single grain loading‐free |
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