| PBGA器件焊点的可靠性分析研究 |
| |
| 引用本文： | 陈该青,蒋健乾,程明生.PBGA器件焊点的可靠性分析研究[J].电子工艺技术,2009,30(1). |
| |
| 作者姓名： | 陈该青 蒋健乾 程明生 |
| |
| 作者单位： | 中国电子科技集团公司第三十八研究所,安徽,合肥,230031 |
| |
| 摘 要： | 根据PBGA器件组装特点,分析了器件焊点的失效机理,并针对实际应用中失效的PBGA器件在温度循环前后,分别使用染色试验、切片分析、X-射线分析等方法进行失效分析.分析结果显示样品PBGA焊点存在不同程度的焊接问题,并且焊接质量的好坏直接影响器件焊点抵抗外界应变应力的能力.最后,开展了PBGA器件焊接工艺研究和可靠性试验,试验结果显示焊接工艺改进后焊点的可靠性良好.
|
| 关 键 词： | 塑料封装球栅阵列 可靠性 失效分析 热循环 |
Reliability Research on Solder Joint of Plastic Ball Grid Array Component |
| |
| CHEN Gai-qing,JIANG Jian-qian,CHENG Ming-sheng.Reliability Research on Solder Joint of Plastic Ball Grid Array Component[J].Electronics Process Technology,2009,30(1). |
| |
| Authors: | CHEN Gai-qing JIANG Jian-qian CHENG Ming-sheng |
| |
| Affiliation: | CETC No.38 Research Institute;Hefei 230031;China |
| |
| Abstract: | According to assembly feature of PBGA component,failure mechanics of solder joint is analyzed.Against PBGA component failed before and after temperature cycling test in practical application,failure analysis is done using dye&pry test,cross section analysis and X-Ray analysis.Analysis results show that solder joint of PBGA component exists different grade of soldering problem,and soldering quality directly effects anti-external stress-strain of component solder joint.In the end,technic research and reliabil... |
| |
| Keywords: | Plastic ball grid array Reliability Invalidity analysis Thermal recycle |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
