|
|||||
|
|
| 无铅电子封装焊料的研究现状与展望 | |
| 引用本文： | 张富文,刘静,杨福宝,贺会军,胡强,朱学新,徐骏,石力开.无铅电子封装焊料的研究现状与展望[J].材料导报,2005,19(11):47-49,64. |
| 作者姓名： | 张富文 刘静 杨福宝 贺会军 胡强 朱学新 徐骏 石力开 |
| 作者单位： | 1. 北京有色金属研究总院,北京,100088;北京康普锡威焊料有限公司,北京,100088 2. 北京有色金属研究总院,北京,100088 3. 北京康普锡威焊料有限公司,北京,100088 |
| 基金项目： | 国家高技术研究发展计划(863计划) |
| 摘 要： | 随着美、日和欧盟就含铅钎料建立相应立法之后,各国都在紧锣密鼓地开展绿色环保无铅产品的研发工作.介绍了国内外无铅焊料所涉及的4种主要成分设计方法,以及当前研究的主要无铅体系及其各自特征;论述了各焊料体系所应用的范围、组织结构和性能,及无铅焊料所关注的主要性能指标和发展趋势,并结合我国国情展望了我国无铅焊料的前进方向. |
| 关 键 词： | 无铅焊料 电子封装 性能 |
Developing Tendency and Current Situation of Lead-free Solder |
|
| ZHANG Fuwen,LIU Jing,YANG Fubao,HE Huijun,HU Qiang,ZHU Xuexin,XU Jun,SHI Likai.Developing Tendency and Current Situation of Lead-free Solder[J].Materials Review,2005,19(11):47-49,64. | |
| Authors: | ZHANG Fuwen LIU Jing YANG Fubao HE Huijun HU Qiang ZHU Xuexin XU Jun SHI Likai |
| Affiliation: | 1 Beijing General Research Institute for Non-ferrous Metals, Beijing 100088; 2 Beijing Kangpuxiwei Welding Material Co. Ltd. , Beijing 100088 |
| Abstract: | With the establishment of green lead-free solder legislation,which declared by US,Japan and EU. more and more countries and companies are engaging in R&D of lead-free solder.This paper reviews the development of lead-free solder,and analyses several main lead-free solder's properties and application field.It also reviews some common reliability problem,developing requirement and tendency of lead-free solder alloy.Further more,the lead free solder development in China is proposed according to the abundant tin resource of China. |
| Keywords: | lead-free solder electronic packaging property |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |
