| 电子封装用高导热金刚石/铜复合材料的研究进展 |
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| 引用本文： | 徐薇,吴益华,闫永杰,王利军.电子封装用高导热金刚石/铜复合材料的研究进展[J].上海第二工业大学学报,2023,40(2):98-103. |
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| 作者姓名： | 徐薇 吴益华 闫永杰 王利军 |
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| 作者单位： | 1. 上海第二工业大学a. 能源与材料学院;2. 南通三责精密陶瓷有限公司, 江苏南通226010,1. 上海第二工业大学a. 能源与材料学院; b. 上海先进热功能材料工程技术研究中心; c. 上海市工程材料应用与评价重点实验室; d. 上海市热物性大数据专业技术服务平台, 上海201209;,2. 南通三责精密陶瓷有限公司, 江苏南通226010,1. 上海第二工业大学a. 能源与材料学院; b. 上海先进热功能材料工程技术研究中心; c. 上海市工程材料应用与评价重点实验室; d. 上海市热物性大数据专业技术服务平台, 上海201209; |
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| 基金项目： | 上海市专业技术服务平台(22DZ2291100) 资助 |
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| 摘 要： | 金刚石/铜复合材料由于具有热导率高、热膨胀系数低等优异的特性,已经逐步替代传统的散热材料,成为新一代电子封装材料。近年来,价格不断下降的人造金刚石和铜这种相对价格低廉的金属结合,实现人们对电子封装材料性能优越、成本可控的要求。介绍了金刚石/铜复合材料的主要制备方法以及如何改善与提高这类材料的热导率。然而,对于当前工业化的迅猛发展以及5G时代的到来,如何实现高热导率的金刚石/铜复合材料的大规模工业生产,仍然是一个挑战。
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| 关 键 词： | 金刚石/铜 电子封装 高热导率 |
Research Progress of Diamond/Copper Composites with High Thermal Conductivity for Electronic Packaging |
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| XU Wei,WU Yi-hu,YAN Yong-jie and WANG Li-jun.Research Progress of Diamond/Copper Composites with High Thermal Conductivity for Electronic Packaging[J].Journal of Shanghai Second Polytechnic University,2023,40(2):98-103. |
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| Authors: | XU Wei WU Yi-hu YAN Yong-jie and WANG Li-jun |
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| Affiliation: | 1a. School of Energy and Materials;2. Nantong Sanzer Precision Ceramics Co., Ltd., Nantong 226010, Jiangsu, China,1a. School of Energy and Materials; 1b. Shanghai Engineering Research Center of Advanced Thermal Functional Materials; 1c. Shanghai Key Laboratory of Engineering Materials Application and Evaluation; 1d. Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Polytechnic University, Shanghai 201209, China;,2. Nantong Sanzer Precision Ceramics Co., Ltd., Nantong 226010, Jiangsu, China and 1a. School of Energy and Materials; 1b. Shanghai Engineering Research Center of Advanced Thermal Functional Materials; 1c. Shanghai Key Laboratory of Engineering Materials Application and Evaluation; 1d. Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Polytechnic University, Shanghai 201209, China; |
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| Abstract: | Diamond/copper composites have gradually replaced the traditional heat dissipation materials and become a new generation of electronic packaging materials due to their high thermal conductivity, low thermal expansion coefficient and other excellent characteristics. In recent years, the combination of inexpensive artificial diamond and copper has realized the control of performance and
cost of electronic packaging materials. This paper mainly introduces the main preparation methods of diamond/copper composites and how to improve and enhance the thermal conductivity of diamond/copper composites. However, for the current rapid development of industrialization and the advent of the 5G era, how to achieve large-scale industrial production of diamond/copper composites with high
thermal conductivity is still a challenge. |
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| Keywords: | diamond/copper electronic packaging high thermal conductivity |
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