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Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero-structured GF/BN networks |
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| Authors: | Chenglin Li Qingyuan Du Changhao Liu Yi An Ying Liu Xiuting Zheng Yue Ru Dali Gao Daming Wu Jingyao Sun |
| Affiliation: | 1. College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing, China
Contribution: ?Investigation (lead), Methodology (lead), Writing - original draft (lead);2. College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing, China Contribution: Conceptualization (equal), Project administration (equal);3. College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing, China Contribution: Conceptualization (supporting), ?Investigation (equal), Project administration (supporting);4. College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing, China State Key Laboratory of Organic-Inorganic Composites, Beijing University of Chemical Technology, Beijing, China Contribution: Validation (equal);5. College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing, China;6. SINOPEC Beijing Research Institute of Chemical Industry, Beijing, China Contribution: Conceptualization (supporting), ?Investigation (equal), Project administration (supporting);7. SINOPEC Beijing Research Institute of Chemical Industry, Beijing, China Contribution: Methodology (equal), Resources (equal) |
| Abstract: | Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, high-thermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm2/s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties. |
| Keywords: | mechanical properties manufacturing thermal properties thermosets |
