SAW滤波器WLP封装中腔体抗模压塌陷研究

通过对声表面波滤波器晶圆级封装结构的探讨,针对在模组封装时器件塌陷成因进行了有限元仿真模型研究,模拟了不同模压量对器件中腔体最大的塌陷量位置。经过实验验证,提出了一种新的金属加强结构,在3 MPa较高模压量时塌陷量几乎为0,解决了声表面波滤波器晶圆级封装芯片灌封压力导致的塌陷问题,降低了器件及模组失效风险,是一种声表面波滤波器晶圆级封装的新技术。

Study on Cavity Collapse Resisting Molding Pressure in WLP of SAW Filter

Through discussion of the wafer level packaging structure of SAW filter, the collapse cause of the device in the module packaging is studied by the finite element simulation model, and the position of the maximum collapse of the cavity in the device with different module pressure is simulated. After practical verification, a new metal reinforced structure is proposed, which can reduce the collapse amount to almost zero at a higher mold pressure of 3 MPa, which solves the collapse problem caused by the encapsulating pressure of SAW filter wafer level packaging chip, and reduces the failure risk of devices and modules. It is a new technique of SAW filter wafer level packaging.