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Packaging investigation of optoelectronic devices
Authors:Zhang Zhike  Liu Yu  Liu Jianguo and Zhu Ninghua
Affiliation:State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences,Beijing 100083, China
Abstract:Compared with microelectronic packaging, optoelectronic packaging as a new packaging type has been developed rapidly and it will play an essential role in optical communication.In this paper, we try to summarize the development history, research status, technology issues and future prospects, and hope to provide a meaningful reference.
Keywords:optoelectronic packaging  PIC  butterfly packaging
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