| 添加剂对铜互连线脉冲电镀的影响 |
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| 引用本文： | 徐赛生,曾磊,顾晓清,张卫.添加剂对铜互连线脉冲电镀的影响[J].中国集成电路,2008,17(7):61-64. |
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| 作者姓名： | 徐赛生 曾磊 顾晓清 张卫 |
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| 作者单位： | 复旦大学微电子学系,复旦-诺发互连研究中心 |
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| 摘 要： | 目前，铜互连技术已成为超大规模集成电路的主流互连技术，铜的填充主要采用Damascene工艺进行电镀。有机添加剂一般包括加速剂、抑制剂和平坦剂，它们在电镀液中含量虽然很少，但对于铜电镀的过程非常关键。以Enthone公司的ViaForm系列添加剂为例，研究了每种类型添加剂对脉冲铜镀层性能的影响。
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| 关 键 词： | 铜互连 添加剂 脉冲电镀 粗糙度 |
Effect of addictive in copper interconnect in pulse plating |
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| XU Sai-sheng,ZENG Lei,GU Xiao-qing,ZHANG Wei.Effect of addictive in copper interconnect in pulse plating[J].China Integrated Circuit,2008,17(7):61-64. |
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| Authors: | XU Sai-sheng ZENG Lei GU Xiao-qing ZHANG Wei |
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| Affiliation: | (Fudan-Novellus Interconnect Research Center ,School of Microelectronics, Fudan University) |
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| Abstract: | copper interconnect is popular technology in VLSI, Damascence process is used to palte copper.Additive include accelerator,suppressor, and leveler, it is so important in plating process,although concentration is little in plating solution .Research effect of every additive in pulse plating copper film as viaform additive of enthone company. |
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| Keywords: | copper interconnect additive pulse plating roughness |
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