Simultaneously enhanced thermal conductivity and dielectric properties of borosilicate glass-based LTCC with AlN and h-BN additions |
| |
| Affiliation: | 1. Institute of Solid State Physics, Hefei Institutes of Physical Science, Chinese Academy of Sciences, Hefei 230031, China;2. University of Science and Technology of China, Hefei 230026, China;3. Key Laboratory of Photovoltaic and Energy Conservation Materials, Chinese Academy of Sciences, Hefei 230031, China;4. Lu''an Branch, Anhui Institute of Innovation for Industrial Technology, Lu''an 237100, China;1. Department of Industrial Engineering, University of Naples “Federico II” 80125 Naples, Italy;2. Institute of Science, Technology and Sustainability for Ceramics, National Research Council of Italy, 48018 Faenza, Italy;1. College of Physics, Sichuan University, Chengdu 610064, China;2. Key Laboratory of Radiation Physics and Technology of Ministry of Education, Sichuan University, Chengdu 610064, China;3. Key Laboratory of High Energy Density Physics of Ministry of Education, Sichuan University, Chengdu 610064, China;1. College of Material Science and Engineering, Sichuan University, Chengdu 610065, China;2. Department of Chemistry and 4D LABS, Simon Fraser University, Burnaby, British Columbia V5A1S6, Canada;3. School of Material Science and Engineering, Shaanxi University of Science and Technology, Xi’an 710021, China;4. Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, School of Electronic and Information Engineering, Xi’an Jiaotong University, Xi’an 710049, China;1. School of Optical and Electronic Information, Key Lab of Functional Materials for Electronic Information (B), MOE, Huazhong University of Science and Technology, Wuhan 430074, China;2. Wenzhou Advanced Manufacturing Institute, Huazhong University of Science and Technology, Wenzhou 325035, PR China;3. School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, China |
| |
| Abstract: | Microwave devices with reduced dielectric loss and electronic components with increased integration density necessitate the higher performance of electronic packaging materials. The h-BN/AlN/CaCO3-MgO-B2O3-SiO2-Li2CO3 glass composites were prepared via tape-casting and then sintered by pressureless and hot-pressing, respectively. The thermal conductivity of pressureless sintered composite was increased to 6.55 W/(m·K) by incorporating 3 wt% h-BN, and the thermal expansion of 4.47 ppm/K was achieved along with low dielectric constant of 5.76 and dielectric loss of 7.02 × 10−4 at 24 GHz. In contrast, the hot-pressing sintered composite containing 4 wt% h-BN exhibited higher thermal conductivity of 10.3 W/(m·K) and lower dielectric loss of 4.77 × 10−4. The microstructure characterization indicated the construction of heat conduction networks, and XRD analysis illustrated the formation of crystallization in the glass. Such low-temperature co-fired ceramic (LTCC) with high thermal conductivity and low dielectric loss would be a promising candidate for electronic packaging and 5G communication applications. |
| |
| Keywords: | LTCC h-BN platelet Hot pressing Thermal conductivity Dielectric property |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
