| 高体积分数SiC_p/Al-Si复合材料的微观组织与导热性能 |
| |
| 引用本文： | 陈成,张国玲,于化顺,张琳,闵光辉.高体积分数SiC_p/Al-Si复合材料的微观组织与导热性能[J].功能材料,2012,43(19):2675-2679. |
| |
| 作者姓名： | 陈成 张国玲 于化顺 张琳 闵光辉 |
| |
| 作者单位： | 1. 山东大学材料液固结构演变与加工教育部重点实验室,山东济南,250061
2. 山东大学工程训练中心,山东济南,250061 |
| |
| 基金项目： | 山东省科技攻关计划资助项目 |
| |
| 摘 要： | 通过对SiC颗粒进行表面改性处理,并向Al基体中添加Si元素合金化采用热压烧结方法制备了Al-10Si-50%(质量分数)SiC复合材料,研究了复合材料的微观组织和导热性能。结果表明,复合材料中SiC颗粒在基体中分布均匀,复合材料组织致密;SiC-Al界面清晰、平直,无过渡层和其它附加物,复合材料界面结合良好;复合材料导热性能优异,其热导率可达189W/(m·K),能够满足电子封装材料的日常使用要求。
|
| 关 键 词： | 表面改性 热压烧结 组织 界面 热导率 |
Microstructure and thermal conduction property of SiCp/Al-Si composite with high volume fraction of SiCp |
| |
| CHEN Cheng,ZHANG Guo-ling,YU Hua-shun,ZHANG Lin,MIN Guang-hui.Microstructure and thermal conduction property of SiCp/Al-Si composite with high volume fraction of SiCp[J].Journal of Functional Materials,2012,43(19):2675-2679. |
| |
| Authors: | CHEN Cheng ZHANG Guo-ling YU Hua-shun ZHANG Lin MIN Guang-hui |
| |
| Affiliation: | 1(1.Key Laboratory for Liquid-Solid Evolution and Processing of Materials, Ministry of Education,Shandong University,Ji’nan 250061,China; 2.Engineering Training Center,Shandong University,Ji’nan 250061,China) |
| |
| Abstract: | Al-10Si-50wt%SiC composite was fabricated by hot pressing sintering technique,through surface modification of SiC and adding Si into Al matrix.Results showed that the SiC particles distributed uniformly in the composite matrix,and overall composite was dense.The interface between SiC and Al was clear,straight and free from transient layer and other reactants.The interface connection was well and the composite showed excellent thermal conductivity as high as 189W/(m·K),which can meet the requirements of electronic packaging materials. |
| |
| Keywords: | surface modification hot pressing sintering microstructure interface thermal conductivity |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
