| 铜基钎料真空钎焊金刚石 |
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| 引用本文： | 刘心宇,张汉城,李东平.铜基钎料真空钎焊金刚石[J].金刚石与磨料磨具工程,2007(3):26-28. |
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| 作者姓名： | 刘心宇 张汉城 李东平 |
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| 作者单位： | 1. 桂林电子科技大学,广西,桂林,541004
2. 国家特种矿物材料工程技术研究中心,广西,桂林,541004;桂林矿产地质研究院,广西,桂林,541004 |
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| 摘 要： | 采用铜基合金钎料,适当控制钎焊工艺,实现了金刚石与钢基体的高强度连接.借助扫描电镜(SEM)、X射线能谱(EDS)、X射线衍射(XRD)分析了真空加热条件下,对铜基合金钎料与金刚石之间的界面反应,钎焊面进行了表面形貌和结构分析.探讨了钎料与金刚右界面处碳化物的形成机理.阐明了在钎焊过程中Ti元素在金刚石界面形成富Ti层并与金刚石表面的C元素反应生成TiC、SnTi C是实现合金层与金刚石有较高结合强度的主要因素.钎料与钢基体在钎焊温度下发生组元间相互扩散,形成了固溶体及其化合物,从而实现钎料与钢基体的高强度结合,并对一系列铜基钎料进行了测试.
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| 关 键 词： | 金刚石 钎焊 化学冶金结合 铜基钎料 真空钎焊 金刚石表面 alloy active diamond vacuum brazing research 测试 结合强度 化合物 固溶体 互扩散 元间 发生 钎焊温度 因素 合金层 反应生成 界面形成 |
| 文章编号： | 1006-852X（2007）03-0026-03 |
| 修稿时间： | 2007-02-14 |
Experimental research on vacuum brazing of diamond with active Cu-based alloy |
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| Liu Xinyu,Zhang Hancheng,Li Dongping.Experimental research on vacuum brazing of diamond with active Cu-based alloy[J].Diamond & Abrasives Engineering,2007(3):26-28. |
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| Authors: | Liu Xinyu Zhang Hancheng Li Dongping |
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| Affiliation: | 1. Guilin University of Electronic Technology , Guilin Guangxi 541004, China;2. National Special Mineral Material Engineering Research Center; Guilin ; Guangxi 541004, China;3. Gui Lin Minerals and Geology Research Institute, Guilin 541004, China |
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| Abstract: | The high-strength bonding between diamond grit and steel matrices was realized by using a Cu-based alloy under controlled brazing conditions. The interface between the Cu-based alloy and diamond grit was analyzed by using scanning electronic microscopes and X-ray diffraction. The formation mechanism of carbide layers was discussed. Testing results show that the Ti element in the alloy is accumulated onto diamond surface and reacts with C element the surface to form all TiC layer. As a result, metallurgical bonding is produced between the alloy and the diamond grit. |
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| Keywords: | diamond grit brazing metallurgical bonding |
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