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铸件溶解扩散焊补过程温度场的数值模拟
引用本文:陈星明,钱翰城.铸件溶解扩散焊补过程温度场的数值模拟[J].重庆大学学报(自然科学版),1996,19(4):71-76.
作者姓名:陈星明  钱翰城
作者单位:重庆大学机械工程二系
摘    要:开发了一种用于铸件溶解扩散焊焊补过程温度场计算的有限元微机软件,实测结果证实了软件计算的正确性。运用该软件分析了热影响区硬度升高的原因并找出了解该问题的途径。

关 键 词:有限元法  数值模拟  温度场  溶解扩散焊  铸件缺陷

Numerical Simulation of Temperature Field during the Dissolution-Diffusion Bonding Process to Mending Iron Casting Defects
Cheng Xinming,Qian Hancheng.Numerical Simulation of Temperature Field during the Dissolution-Diffusion Bonding Process to Mending Iron Casting Defects[J].Journal of Chongqing University(Natural Science Edition),1996,19(4):71-76.
Authors:Cheng Xinming  Qian Hancheng
Affiliation:Cheng Xinming;Qian Hancheng
Abstract:The common finite element method microcomputer software for simulation of the temperature field is developed by authors. It is used for calculating the temperature field duringthe mending process of iron casting defects by means of the dissolution-diffusion bonding technology. The correctness has been proved by testing results. This software has been used to analyse thecaused of hardness rising in heat effecting zone,and also find out the approach for solving the problem.
Keywords:s:finite element methods  numerical simulation  temperature field/dissolutiondiffusion bonding  casting defects  
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