C/SiC复合材料微孔的电镀金刚石钻头钻削加工

用金刚石基本颗粒尺寸分别为20～30,36～54和63～75μm，直径在0.280～0.440 mm范围的6种电镀金刚石钻头，钻削三维针刺毡基C/SiC复合材料微孔，测试6种钻头的最佳加工工艺参数，分析工艺参数及金刚石基本颗粒尺寸、钻头直径等对微孔加工质量、加工效率的影响。结果表明：在相同钻削速度条件下，进给速度越低时，加工的微孔质量越好；钻头电镀的金刚石磨粒基本颗粒尺寸越大，其钻削效率越高；在6种钻头中，直径为0.300 mm的基体上电镀63～75μm的磨粒，直径为0.200 mm的基体上电镀36～54μm的磨粒，能够获得更优的钻孔性能。

Drilling of C/SiC composite micro holes with electroplated diamond bits

Six kinds of diamond electroplated bits, whose diameters were 0.280～0.440 mm and the basic particle sizes of diamond were 20～30, 36～54 and 63～75 μm, were used to drill micro holes of three-dimensional needle-punched felt-based C/SiC composite materials. The optimum processing parameters of the six kinds of bits were tested, and the influences of the process parameters, the diamond basic particle size and the bit diameter on the processing quality and efficiency of micro holes were analyzed. The results show that at the same drilling speed, the lower the feed speed is, the better the micro-hole quality is. The larger the basic particle size of electroplated diamond grains on the bit is, the higher the drilling efficiency is. In the six kinds of bits, the better drilling performances can be obtained by electroplating 63～75 μm abrasive particles on 0.300 mm diameter substrate and 36～54 μm abrasive particles on 0.200 mm diameter substrate.