| RE对SnAgCu钎料合金及焊点性能的影响 |
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| 引用本文： | 王要利,张柯柯,李臣阳,衡中皓.RE对SnAgCu钎料合金及焊点性能的影响[J].材料热处理学报,2011,32(12). |
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| 作者姓名： | 王要利 张柯柯 李臣阳 衡中皓 |
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| 作者单位： | 河南科技大学材料科学与工程学院,河南洛阳,471003 |
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| 基金项目： | 国家自然科学基金(50774029); 河南省高校创新人才基金(教高2004-294); 河南省杰出青年科学基金(074100510011) |
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| 摘 要： | 利用JSM-5610LV扫描电镜（SEM）及能谱分析（EDS）等测量方法,研究了微量RE对Sn-2.5Ag-0.7Cu无铅钎料的显微组织、润湿特性、拉伸强度及焊点剪切强度和蠕变断裂寿命的影响。结果表明,向Sn-2.5Ag-0.7Cu中添加0.1%RE可明显细化钎料合金的显微组织,改善钎料合金的润湿特性,提高钎料合金的抗拉强度、伸长率及焊点剪切强度,增加焊点的蠕变断裂寿命。当RE添加量为0.5%时,由于形成了RE化合物而明显恶化钎料合金的性能。
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| 关 键 词： | Sn2.5Ag0.7CuxRE钎料合金 显微组织 润湿特性 强度 蠕变断裂寿命 |
Effect of RE on properties of SnAgCu solder alloy and its joints |
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| WANG Yao-li,ZHANG Ke-ke,LI Chen-yang,HENG Zhong-hao.Effect of RE on properties of SnAgCu solder alloy and its joints[J].Transactions of Materials and Heat Treatment,2011,32(12). |
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| Authors: | WANG Yao-li ZHANG Ke-ke LI Chen-yang HENG Zhong-hao |
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| Affiliation: | WANG Yao-li,ZHANG Ke-ke,LI Chen-yang,HENG Zhong-hao(College of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003 China) |
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| Abstract: | Effect of RE on microstructure,wetting property,tensile strength of Sn2.5Ag0.7Cu solder alloy and shear strength,creep rupture life of its solder joints were investigated by means of scanning electronic microscopy(SEM) and energy dispersive spectrum analysis.The results show that adding 0.1% RE in Sn2.5Ag0.7Cu solder alloy can apparently refine the microstructure,greatly improve its wetting properties,tensile strength and elongation of the solder alloy.Meanwhile,shear strength and creep rupture life of the ... |
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| Keywords: | Sn2 5Ag0 7CuxRE solder microstructure wetting property strength creep ruprure life |
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