| 环境对各向异性导电胶膜性能参数的影响 |
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| 引用本文： | 张军,贾宏,陈旭.环境对各向异性导电胶膜性能参数的影响[J].中国集成电路,2007,16(3):58-62. |
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| 作者姓名： | 张军 贾宏 陈旭 |
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| 作者单位： | 郑州大学化工学院 |
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| 摘 要： | 各向异性导电胶膜(ACF)的玻璃转化温度Tg是它的一个重要性能参数,用差示扫描热示计(DSC)分别测定商用各向异性导电胶膜固化前和固化后的玻璃转化温度,并确定改变固化时间对它的玻璃转化温度的影响,以及高温高湿(85℃,85%RH)环境对它的玻璃转化温度的影响,得到各向异性导电胶玻璃转化温度下降是其粘接强度下降的原因之一。
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| 关 键 词： | 微电子封装 各向异性导电胶 玻璃转化温度 粘接强度 |
The effect of environment for the anisotropic conductive adhesive film(ACF)capability parameter |
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| ZHANG Jun,JIA Hong,CHEN Xu.The effect of environment for the anisotropic conductive adhesive film(ACF)capability parameter[J].China Integrated Circuit,2007,16(3):58-62. |
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| Authors: | ZHANG Jun JIA Hong CHEN Xu |
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| Abstract: | The glass change temperature(Tg)is an important capability parameter for the anisotropic conductive adhesive film(ACF),the DSC is used to discover the glass change temperature(Tg)of the ACF after and before curing and different curing time.The effect of high temperature and humidity for the ACF also is discovered.The result can be found that the glass change temperature decrease is the one of reasons of ACF bonding strength decrease. |
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| Keywords: | Microelectronic packaging anisotropic conductive adhesive film glass change temperature bonding strength |
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