MoSi_2增强铜基复合材料的组织与性能

用热压烧结的方法制备了一种以金属间化合物MoSi_2作为增强相的Cu基复合材料,并对其组织、力学性能和导电性能进行了研究.结果表明,MoSi_2是一种合适的铜基复合材料的增强相,MoSi_2/Cu复合材料具有良好的稳定性;MoSi_2具有明显的细化晶粒强化基体的作用;随MoSi_2含量的增加,MoSi_2/Cu复合材料的密度和电导率下降,硬度和抗拉强度表现为先增加后降低;加入2%MoSi_2时,复合材料具有最佳的综合性能,其相对密度和电导率分别为97.44%和68%IACS,硬度和抗拉强度分别为142HV和355MPa,是相同制备条件下纯铜硬度和抗拉强度的2倍多.

Microstructure and properties of MoSi_2 particles dispersion strengthened copper-base composite

A novel Ca matrix composite reinforced by MoSi_2 intermetallie was developed by hot pressing sintering method. The microstrueture,mechanical properties and conductive properties of the Cu matrix composite were investigated. The results indicate that MoSi_2 is an effective reinforcement for Cu and the MoSi_2/Cu composite exhibit good stability. MoSi_2 can effectively restrain growth of grains of Cu matrix during sintering. With the increase of MoSi_2 content, density and conductivity of the composite decrease, and its hardness and tensile strength increase first and then decrease. The composite with 2% MoSi2 exhibits the optimal combination of performance with relative density of 97.44% and conductivity of 68% IACS. Hardness and tensile strength of the composite with 2% MoSi2 are 142HV and 355MPa, respectively. Its tensile strength is twice of the pure Cu sintered at the same preparation condition.