|
|||||
|
|
Effect of electromigration and isothermal aging on interfacial microstructure and tensile fracture behavior of SAC305/Cu solder joint |
|
| Authors: | Wei Guoqiang Liu Henglin Du Longchun and Yao Jian |
| Affiliation: | School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640 |
| Abstract: | |
| Keywords: | electromigration isothermal aging intermetallic compound mechanical property |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |
| 点击此处可从《中国焊接》浏览原始摘要信息 | |
| 点击此处可从《中国焊接》下载全文 | |
