| 各向异性导电胶互连技术的研究进展 |
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| 引用本文： | 蔺永诚,陈旭.各向异性导电胶互连技术的研究进展[J].电子与封装,2006,6(7):1-7,20. |
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| 作者姓名： | 蔺永诚 陈旭 |
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| 作者单位： | 天津大学化工学院,天津,300072 |
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| 基金项目： | 国家高技术研究发展计划(863计划);教育部优秀青年教师资助计划 |
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| 摘 要： | 随着微电子封装技术的发展,各向异性导电胶作为一种绿色的连接材料,广泛应用于电子产品中。文中主要介绍各向异性导电胶互连器件的粘接原理和影响其可靠性的各种因素,如粘接工艺参数、外界环境的干扰、各向异性导电胶的物理特性等。
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| 关 键 词： | 各向异性导电胶 电子封装 可靠性 |
| 文章编号： | 1681-1070（2006）07-0001-07 |
| 收稿时间： | 2005-12-02 |
| 修稿时间： | 2005-12-02 |
Progress of Anisotropic Conductive Adhesive Interconnected Technology |
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| LIN Yong-cheng,CHEN Xu.Progress of Anisotropic Conductive Adhesive Interconnected Technology[J].Electronics & Packaging,2006,6(7):1-7,20. |
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| Authors: | LIN Yong-cheng CHEN Xu |
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| Affiliation: | School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China |
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| Abstract: | With the development of microelectronic packaging technologies,anisotropic conductive adhesives(ACA)are widely used as one kind of the green materials in the electronic interconnection.In thispaper,the principles of the ACA joints and the influencing factors on reliability,including the bonding process parameters,disturbance of environments,and the properties of the ACA,have been reviewed. |
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| Keywords: | anisotropic conductive adhesive electronic packaging reliability |
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