新型磁驱动增大检测电容的高精度MEMS惯性传感器研究

增大传感器振子的质量和静态测试电容可以减小电容式MEMS惯性传感系统的噪声，而深度粒子反应刻蚀工艺由于复杂的工艺原因，当深宽比较大时，不能刻蚀出大质量和大初始电容的传感器.据此，本文研究了一种磁驱动增大检测电容的MEMS惯性传感器，通过电磁驱动器，传感器的静态测试电容可以大幅增加，在梳齿电容上刻蚀阻尼槽后，其机械噪声达到0.61μg每根号赫兹，仿真其共振频率为598Hz，静态位移灵敏度为0.7μm每重力加速度，基于硅 玻璃键合工艺，制作了栅形条电容式惯性传感器，并用电磁驱动的方式测试其品质因子达到715，从而验证了制作工艺的可行性和电磁驱动器改变传感器初始静态测试电容的可行性.

A Novel MEMS Inertial Sensor with the Actuators Drived by Lorentz Force for Increasing the Initial Sensing Capacitance

The noise of capacitive MEMS inertial sensor system can be depressed by increasing the mass of the seismic and initial sensing capacitance,which can not be obtained by deep ion etch process when the aspect ratio of comb capacitance is very large.Accordingly,a novel super high precision MEMS inertial sensor with the actuators drived by Lorentz force for increasing the initial sensing capacitance is developed in this paper.The initial sensitive capacitance is increased largely by the actuators,the mechanical noise is reduced to 0.61ug per square root Hz by etching damping slots in the sensitive combs of actuators.The resonant frequency obtained by ANSYS is 598Hz,and the static displacement sensitivity is 0.7μm per g acceleration of gravity.The grid capacitive inertial sensor is fabricated by MEMS silicon-glass bonding process,and the quality factor tested by which the sensor is drived by Lorentz force is 715 in air,which proves the feasibility of the idea that the novel MEMS sensor can be fabricated by silicon glass bonding process and its initial sensing capacitance can be increased by Lorentz force actuators.