Reliability of high-speed SiGe heterojunction bipolar transistors under very high forward current density |
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Authors: | Jae-Sung Rieh Watson KM Guarin F Zhijian Yang Ping-Chuan Wang Joseph AJ Freeman G Subbanna S |
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Affiliation: | IBM Semicond. R&D Center, Hopewell Junction, NY, USA; |
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Abstract: | As device scaling for higher performance bipolar transistors continues, the operation current density increases as well. To investigate the reliability impact of the increased operation current density on Si-based bipolar transistors, an accelerated-current wafer-level stress was conducted on 120-GHz SiGe heterojunction bipolar transistors (HBTs), with stress current density up to as high as J/sub C/=34 mA//spl mu/m/sup 2/. With a novel projection technique based on accelerated-current stress, a current gain shift of less than /spl sim/15% after 10/sup 6/ h of operation is predicted at T=140/spl deg/C. Degradation mechanisms for the observed dc parameter shifts are discussed for various V/sub BE/ regions, and the separation of the current stress effect from the self-heating effect is made based on thermal resistance of the devices. Module-level stress results are shown to be consistent with wafer-level stress results. The results obtained in this work indicate that the high-speed SiGe HBTs employed for the stress are highly reliable for long-term operation at high operation current density. |
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