首页 | 官方网站   微博 | 高级检索  
     

装联工艺中低频电缆组件的电磁兼容问题
引用本文:宋冬,缪科,邓洪.装联工艺中低频电缆组件的电磁兼容问题[J].电子工艺技术,2011,32(4):212-216.
作者姓名:宋冬  缪科  邓洪
作者单位:中国电子科技集团第二十九研究所,四川,成都,610036
摘    要:随着电子信息技术的发展,越来越多的电子设备系统都有电磁兼容性要求.低频电缆组件作为电子设备的组成部分,其电磁兼容问题尤为重要.从线缆的选取、导线屏蔽层的处理和电缆屏蔽层与机箱的搭接三方面论述了电缆组件制造和与系统装联时应遵循的电磁兼容工艺要求,并介绍了一些行之有效的工艺处理方法.

关 键 词:电磁兼容性  低频电缆组件  屏蔽

Analysis On Electromagnetic Compatibility of Low Frequency Cable In Assembly
SONG Dong,MIAO Ke,DENG Hong.Analysis On Electromagnetic Compatibility of Low Frequency Cable In Assembly[J].Electronics Process Technology,2011,32(4):212-216.
Authors:SONG Dong  MIAO Ke  DENG Hong
Affiliation:SONG Dong,MIAO Ke,DENG Hong(CETC No.29 Research Institute,Chengdu 610036,China)
Abstract:With the development of electronic information technology,more and more electronic equipments have the requirements of electromagnetic compatibility.Low frequency cable is essential part of electronic equipment,and its electromagnetic compatibility is important.Discuss craft requirements of cable module manufacturing and system assembly from wire and cable types selection,disposal of shields,splicing of shields and box.Introduce some effective methods.
Keywords:Electromagnetic Compatibility  Low Frequency Cable Assembly  Shield  
本文献已被 CNKI 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号