| 基于BCB键合的MEMS加速度计圆片级封装工艺 |
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| 引用本文： | 刘磊,展明浩,李苏苏,陈博.基于BCB键合的MEMS加速度计圆片级封装工艺[J].电子科技,2012,25(9):9-12. |
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| 作者姓名： | 刘磊 展明浩 李苏苏 陈博 |
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| 作者单位： | 1. 合肥工业大学电子科学与应用物理学院,安徽合肥,230009
2. 中国兵器工业集团214研究所工艺1部,安徽蚌埠,233042 |
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| 摘 要： | 对基于BCB的圆片级封装工艺进行了研究，该工艺代表了MEMS加速度计传感器封装的发展趋势，是MEMS加速度计产业化的关键。选用3000系列BCB材料进行MENS传感器的粘结键合工艺试验，解决了圆片级封装问题，在低温250℃和适当压力辅助下≤2．5bar（1bar=100kPa）实现了加速度计的圆片级封装，并对相关的旋涂、键合、气氛、压力等诸多工艺参数进行了优化。
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| 关 键 词： | MEMS加速度计 圆片级封装 苯并环丁烯（BCB） |
Wafer-level Adhesive Bonding with Benzocyclobutene for the Accelerometer |
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| LIU Lei,ZHAN Minghao,LI Susu,CHEN Bo.Wafer-level Adhesive Bonding with Benzocyclobutene for the Accelerometer[J].Electronic Science and Technology,2012,25(9):9-12. |
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| Authors: | LIU Lei ZHAN Minghao LI Susu CHEN Bo |
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| Affiliation: | 1.School of Electronic Science and Applied Physics,Hefei University of Technology,Hefei 230009,China; 2.First Unit of Technology,214 Institute of China North Industries Group,Bengbu 233042,China) |
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| Abstract: | The wafer-level adhesive bonding based on BCB is studied.It is the packaging trend for the MEMS accelerometer and is essential to the industrialization of the MEMS accelerometer.A novel MEMS wafer level packaging method is achieved by the BCB bonding technique with the BCB 3000 as a bonding material.The wafer level packaging at low temperature(250 ℃) and proper pressure(≤2.5 bar) is realized.The related process parameters of spin coating,bonding,atmosphere,and bonding pressure and etc.are optimized. |
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| Keywords: | MEMS accelerometer wafer level packaging BCB |
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